Package Design

We provide a wide range of Services

Leading provider of best 3D IC packaging design:

Briddlee offers you the best IC packaging design, planning, and layout for advanced packages. Integrated circuits are the heart of the design. It differs from the traditional method and gives more efficiency to the system design. It is applicable in mobile computing, automotive, 5G, artificial intelligence (AI), augmented reality (AR) and virtual reality (VR), high-performance computing (HPC), IoT, medical, and aerospace. This integration technology helps to reduce cost, and size, increase performance, and power optimizations that satisfy the need of multiple markets. Users satisfaction is the main aim of Briddlee.

High skilled Package designing Techniques:

In Briddlee, the IC design packages cover the technologies like flip-chip, wirebond, stacked-die, System-in-Package (SiP), Package-on-Package (PoP), Packagein-Package (PiP), Chip-Scale-Package (CSP) and other vertical space transformers(MLO/MLC) meant for ATE testing applications We offer package solutions for high-speed digital ICs, mixed-signal ICs, and RFIC products. Package design has become very complex with ever increasing data – rates and shrinking IC fabrication process technology (40nm, 28nm, 20nm, 12nm), etc., each design service is uniquely customized for every customer’s needs. So their product can be peculiar in the market.

How does Briddlee's design differ from others?

There are numerous advantages to our IC package design. It has an extremely small size, low power consumption, reliability, low cost, a very lightweight, and is simple to replace. Once the product is designed, it will function flawlessly, and Briddlee’s service is always available to assist you. Our journey with you will continue until the end, with the best results for you. Robots and their controllers make extensive use of integrated circuits. This is the advanced technology in the market, we do help in designing robotic process automation. So with the help of this technique, users can find the error in the software at ease.

It is a kind of bot that helps you to assist in your work. Briddlee design tools are items, media, or computer programs that can be used to create artwork. They can affect the development, appearance, and impression of design concepts, so they must be used with caution. Our RPA operates at the user experience level, it can successfully sit on top of your existing systems. This means it can switch between apps and programs just like you. It uses the same displays you do and tends to work with the same front-end options.

Why go with the Briddlee design package?

Our team will help you to bring out what you need. Each IC design is uniquely done as per the requirement of the customer’s need. All services done at Briddlee are budget-friendly and cover the latest technological tools too. So customers can get whatever they need in a single package and the journey with Briddlee will continue till last. In case of any repair, our team is always ready to give their hand. Your satisfaction is our priority.

Experience the 3D designing of IC packaging

With years of experience in IC package designing, we tailor our clients with the best quality package designs. Our package designing team will work together to evaluate and enhance the entire network and not only the specific components.

Top tier design

We keep in mind to create a Package design that precise the combination of Nanostructures. We prepare a custom design to perform the needs of the customer. Our designers will efficiently construct and maintain multiple interconnects using the Design Force native 3D platform. 

Customizable efficacy

We provide an easy-to-use, complete IC package design for software for one- and two cord, switch, and high-density advanced packaging applications. Our experienced designers can start their designs with early design entry of device and packaging data from the database, utilize information from IC core skills, and save time by using customizable techniques.

Dependability

We also look after the package’s thermal and mechanical aspects while designing the IC package. Package design has become extremely difficult as data rates have increased and IC manufacturing process technologies have reduced. So we design the package that aids you with confronting the facing difficulties.

Timeliness

We respect you and our time, therefore we create and meet goals that keep you on track. We deal with a wide range of package designs, and we provide several packaging options for high-speed electronic, combined, and High – power and high products.